世界のボンダー設備市場2020-2025:全自動式、半自動式、手動式

【英語タイトル】Global Die Bonder Equipment Market Growth 2020-2025

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・発行日:2020年3月12日
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・レポート言語:英語
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・産業分野:機械・装置
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「ボンダー設備の世界市場」は、地域的には米州、アジア、欧州、中東・アフリカ市場をカバーしており、種類別には、全自動式、半自動式、手動式など、用途別には、統合デバイスメーカー(IDM)、外部委託半導体アセンブリ&テスト(OSAT)などに区分してまとめた調査レポートです。ボンダー設備のグローバル市場規模、主要地域・主要国別、種類別、用途別の市場予測、主要企業の概要・市場シェア・販売量、市場動向などの情報が含まれています。
・ボンダー設備の世界市場概要(サマリー)
・ボンダー設備の企業別販売量・売上
・ボンダー設備の企業別市場シェア
・ボンダー設備の世界市場規模 2015年-2020年:種類別(全自動式、半自動式、手動式)
・ボンダー設備の世界市場規模 2015年-2020年:用途別(統合デバイスメーカー(IDM)、外部委託半導体アセンブリ&テスト(OSAT))
・ボンダー設備の米州市場規模(アメリカ、カナダ、メキシコなど)
・ボンダー設備のアジア市場規模(日本、中国、韓国、インド、東南アジアなど)
・ボンダー設備の欧州市場規模(ドイツ、フランス、イギリス、イタリア、ロシアなど)
・ボンダー設備の中東・アフリカ市場(エジプト、南アフリカ、トルコ、GCC諸国など)
・ボンダー設備市場の成長要因・課題・動向
・ボンダー設備の世界市場予測 2021年-2025年
・ボンダー設備の米州市場予測(アメリカ、カナダ、メキシコなど)
・ボンダー設備のアジア市場予測(日本、中国、韓国、インド、東南アジアなど)
・ボンダー設備の欧州市場予測(ドイツ、フランス、イギリス、イタリア、ロシアなど)
・ボンダー設備の中東・アフリカ市場予測(エジプト、南アフリカ、トルコ、GCC諸国など)
・ボンダー設備の世界市場予測:種類別(全自動式、半自動式、手動式)
・ボンダー設備の世界市場予測:用途別(統合デバイスメーカー(IDM)、外部委託半導体アセンブリ&テスト(OSAT))
・主要企業分析
【レポートの概要】

According to this study, over the next five years the Die Bonder Equipment market will register a 0.5% CAGR in terms of revenue, the global market size will reach $ 781.1 million by 2025, from $ 764.1 million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in Die Bonder Equipment business, shared in Chapter 3.

This report presents a comprehensive overview, market shares, and growth opportunities of Die Bonder Equipment market by type, application, key manufacturers and key regions and countries.

This study considers the Die Bonder Equipment value and volume generated from the sales of the following segments:

Segmentation by type: breakdown data from 2015 to 2020, in Section 2.3; and forecast to 2025 in section 11.7.
Fully Automatic
Semi-Automatic
Manual

Segmentation by application: breakdown data from 2015 to 2020, in Section 2.4; and forecast to 2024 in section 11.8.
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)

This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Spain
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report: Breakdown data in in Chapter 3.
Besi
West-Bond
ASM Pacific Technology (ASMPT)
Palomar Technologies
Shinkawa
Kulicke & Soffa
Panasonic
DIAS Automation
FASFORD TECHNOLOGY
Toray Engineering
Hybond

In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.

Research objectives
To study and analyze the global Die Bonder Equipment consumption (value & volume) by key regions/countries, type and application, history data from 2015 to 2019, and forecast to 2025.
To understand the structure of Die Bonder Equipment market by identifying its various subsegments.
Focuses on the key global Die Bonder Equipment manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the Die Bonder Equipment with respect to individual growth trends, future prospects, and their contribution to the total market.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
To project the consumption of Die Bonder Equipment submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.

【レポートの目次】

Table of Contents

1 Scope of the Report
1.1 Market Introduction
1.2 Research Objectives
1.3 Years Considered
1.4 Market Research Methodology
1.5 Data Source
1.6 Economic Indicators
1.7 Currency Considered

2 Executive Summary
2.1 World Market Overview
2.1.1 Global Die Bonder Equipment Consumption 2015-2025
2.1.2 Die Bonder Equipment Consumption CAGR by Region
2.2 Die Bonder Equipment Segment by Type
2.2.1 Fully Automatic
2.2.2 Semi-Automatic
2.2.3 Manual
2.3 Die Bonder Equipment Consumption by Type
2.3.1 Global Die Bonder Equipment Consumption Market Share by Type (2015-2020)
2.3.2 Global Die Bonder Equipment Revenue and Market Share by Type (2015-2020)
2.3.3 Global Die Bonder Equipment Sale Price by Type (2015-2020)
2.4 Die Bonder Equipment Segment by Application
2.4.1 Integrated Device Manufacturers (IDMs)
2.4.2 Outsourced Semiconductor Assembly and Test (OSAT)
2.5 Die Bonder Equipment Consumption by Application
2.5.1 Global Die Bonder Equipment Consumption Market Share by Type (2015-2020)
2.5.2 Global Die Bonder Equipment Value and Market Share by Type (2015-2020)
2.5.3 Global Die Bonder Equipment Sale Price by Type (2015-2020)

3 Global Die Bonder Equipment by Company
3.1 Global Die Bonder Equipment Sales Market Share by Company
3.1.1 Global Die Bonder Equipment Sales by Company (2018-2020)
3.1.2 Global Die Bonder Equipment Sales Market Share by Company (2018-2020)
3.2 Global Die Bonder Equipment Revenue Market Share by Company
3.2.1 Global Die Bonder Equipment Revenue by Company (2018-2020)
3.2.2 Global Die Bonder Equipment Revenue Market Share by Company (2018-2020)
3.3 Global Die Bonder Equipment Sale Price by Company
3.4 Global Die Bonder Equipment Manufacturing Base Distribution, Sales Area, Type by Company
3.4.1 Global Die Bonder Equipment Manufacturing Base Distribution and Sales Area by Company
3.4.2 Players Die Bonder Equipment Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) (2018-2020)
3.6 New Products and Potential Entrants
3.7 Mergers & Acquisitions, Expansion

4 Die Bonder Equipment by Regions
4.1 Die Bonder Equipment by Regions
4.2 Americas Die Bonder Equipment Consumption Growth
4.3 APAC Die Bonder Equipment Consumption Growth
4.4 Europe Die Bonder Equipment Consumption Growth
4.5 Middle East & Africa Die Bonder Equipment Consumption Growth

5 Americas
5.1 Americas Die Bonder Equipment Consumption by Countries
5.1.1 Americas Die Bonder Equipment Consumption by Countries (2015-2020)
5.1.2 Americas Die Bonder Equipment Value by Countries (2015-2020)
5.2 Americas Die Bonder Equipment Consumption by Type
5.3 Americas Die Bonder Equipment Consumption by Application
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
5.8 Key Economic Indicators of Few Americas Countries

6 APAC
6.1 APAC Die Bonder Equipment Consumption by Regions
6.1.1 APAC Die Bonder Equipment Consumption by Regions (2015-2020)
6.1.2 APAC Die Bonder Equipment Value by Regions (2015-2020)
6.2 APAC Die Bonder Equipment Consumption by Type
6.3 APAC Die Bonder Equipment Consumption by Application
6.4 China
6.5 Japan
6.6 Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 Key Economic Indicators of Few APAC Regions

7 Europe
7.1 Europe Die Bonder Equipment by Countries
7.1.1 Europe Die Bonder Equipment Consumption by Countries (2015-2020)
7.1.2 Europe Die Bonder Equipment Value by Countries (2015-2020)
7.2 Europe Die Bonder Equipment Consumption by Type
7.3 Europe Die Bonder Equipment Consumption by Application
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
7.9 Spain
7.10 Key Economic Indicators of Few Europe Countries

8 Middle East & Africa
8.1 Middle East & Africa Die Bonder Equipment by Countries
8.1.1 Middle East & Africa Die Bonder Equipment Consumption by Countries (2015-2020)
8.1.2 Middle East & Africa Die Bonder Equipment Value by Countries (2015-2020)
8.2 Middle East & Africa Die Bonder Equipment Consumption by Type
8.3 Middle East & Africa Die Bonder Equipment Consumption by Application
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries

9 Market Drivers, Challenges and Trends
9.1 Market Drivers and Impact
9.1.1 Growing Demand from Key Regions
9.1.2 Growing Demand from Key Applications and Potential Industries
9.2 Market Challenges and Impact
9.3 Market Trends

10 Marketing, Distributors and Customer
10.1 Sales Channel
10.1.1 Direct Channels
10.1.2 Indirect Channels
10.2 Die Bonder Equipment Distributors
10.3 Die Bonder Equipment Customer

11 Global Die Bonder Equipment Market Forecast
11.1 Global Die Bonder Equipment Consumption Forecast (2021-2025)
11.2 Global Die Bonder Equipment Forecast by Regions
11.2.1 Global Die Bonder Equipment Forecast by Regions (2021-2025)
11.2.2 Global Die Bonder Equipment Value Forecast by Regions (2021-2025)
11.2.3 Americas Consumption Forecast
11.2.4 APAC Consumption Forecast
11.2.5 Europe Consumption Forecast
11.2.6 Middle East & Africa Consumption Forecast
11.3 Americas Forecast by Countries
11.3.1 United States Market Forecast
11.3.2 Canada Market Forecast
11.3.3 Mexico Market Forecast
11.3.4 Brazil Market Forecast
11.4 APAC Forecast by Countries
11.4.1 China Market Forecast
11.4.2 Japan Market Forecast
11.4.3 Korea Market Forecast
11.4.4 Southeast Asia Market Forecast
11.4.5 India Market Forecast
11.4.6 Australia Market Forecast
11.5 Europe Forecast by Countries
11.5.1 Germany Market Forecast
11.5.2 France Market Forecast
11.5.3 UK Market Forecast
11.5.4 Italy Market Forecast
11.5.5 Russia Market Forecast
11.5.6 Spain Market Forecast
11.6 Middle East & Africa Forecast by Countries
11.6.1 Egypt Market Forecast
11.6.2 South Africa Market Forecast
11.6.3 Israel Market Forecast
11.6.4 Turkey Market Forecast
11.6.5 GCC Countries Market Forecast
11.7 Global Die Bonder Equipment Forecast by Type
11.8 Global Die Bonder Equipment Forecast by Application

12 Key Players Analysis
12.1 Besi
12.1.1 Company Information
12.1.2 Die Bonder Equipment Product Offered
12.1.3 Besi Die Bonder Equipment Sales, Revenue, Price and Gross Margin (2018-2020)
12.1.4 Main Business Overview
12.1.5 Besi Latest Developments
12.2 West-Bond
12.2.1 Company Information
12.2.2 Die Bonder Equipment Product Offered
12.2.3 West-Bond Die Bonder Equipment Sales, Revenue, Price and Gross Margin (2018-2020)
12.2.4 Main Business Overview
12.2.5 West-Bond Latest Developments
12.3 ASM Pacific Technology (ASMPT)
12.3.1 Company Information
12.3.2 Die Bonder Equipment Product Offered
12.3.3 ASM Pacific Technology (ASMPT) Die Bonder Equipment Sales, Revenue, Price and Gross Margin (2018-2020)
12.3.4 Main Business Overview
12.3.5 ASM Pacific Technology (ASMPT) Latest Developments
12.4 Palomar Technologies
12.4.1 Company Information
12.4.2 Die Bonder Equipment Product Offered
12.4.3 Palomar Technologies Die Bonder Equipment Sales, Revenue, Price and Gross Margin (2018-2020)
12.4.4 Main Business Overview
12.4.5 Palomar Technologies Latest Developments
12.5 Shinkawa
12.5.1 Company Information
12.5.2 Die Bonder Equipment Product Offered
12.5.3 Shinkawa Die Bonder Equipment Sales, Revenue, Price and Gross Margin (2018-2020)
12.5.4 Main Business Overview
12.5.5 Shinkawa Latest Developments
12.6 Kulicke & Soffa
12.6.1 Company Information
12.6.2 Die Bonder Equipment Product Offered
12.6.3 Kulicke & Soffa Die Bonder Equipment Sales, Revenue, Price and Gross Margin (2018-2020)
12.6.4 Main Business Overview
12.6.5 Kulicke & Soffa Latest Developments
12.7 Panasonic
12.7.1 Company Information
12.7.2 Die Bonder Equipment Product Offered
12.7.3 Panasonic Die Bonder Equipment Sales, Revenue, Price and Gross Margin (2018-2020)
12.7.4 Main Business Overview
12.7.5 Panasonic Latest Developments
12.8 DIAS Automation
12.8.1 Company Information
12.8.2 Die Bonder Equipment Product Offered
12.8.3 DIAS Automation Die Bonder Equipment Sales, Revenue, Price and Gross Margin (2018-2020)
12.8.4 Main Business Overview
12.8.5 DIAS Automation Latest Developments
12.9 FASFORD TECHNOLOGY
12.9.1 Company Information
12.9.2 Die Bonder Equipment Product Offered
12.9.3 FASFORD TECHNOLOGY Die Bonder Equipment Sales, Revenue, Price and Gross Margin (2018-2020)
12.9.4 Main Business Overview
12.9.5 FASFORD TECHNOLOGY Latest Developments
12.10 Toray Engineering
12.10.1 Company Information
12.10.2 Die Bonder Equipment Product Offered
12.10.3 Toray Engineering Die Bonder Equipment Sales, Revenue, Price and Gross Margin (2018-2020)
12.10.4 Main Business Overview
12.10.5 Toray Engineering Latest Developments
12.11 Hybond
12.11.1 Company Information
12.11.2 Die Bonder Equipment Product Offered
12.11.3 Hybond Die Bonder Equipment Sales, Revenue, Price and Gross Margin (2018-2020)
12.11.4 Main Business Overview
12.11.5 Hybond Latest Developments

13 Research Findings and Conclusion



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